Shenzhen Goldlink Tongda Electronics Co., Ltd
Business description
Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
Latest listings
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Non Silicone Grease Xk Xn50 Thermal Interface ConductiveGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 2, 2016 - contact company for price
Introduction XK- XN has been engineered to solve the problems of contamination and migration. The compound is Polysynthetic based. Thermal Grease is used for rapid and efficient heat transfer and dissipation. Features N on- silicone Non- curing Resis...
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Thermally Conductive Phase Change Materials Xk C35 Thermal InterfaceGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 2, 2016 - contact company for price
Introduction XK- C is produced on the basis of phase- changing properties. Apply to irregular surface between the power module and heat sink, when the application temperature goes above stated temperature, the material will flow and improve the conta...
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Thermal Radiation Graphite Sheet Xk Ray310 Interface ConductiveGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 2, 2016 - contact company for price
Introduction Graphite Thermal radiation Pad- XK- Ray310: The high conductivity performance and full thermal radiation spectrum of Graphite increases the thermal conductive effort and reduces the weight and volume of heat spreader. Features - Ultra th...
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Vibration Damping Silicone Pad Xk Gel 100 Shock And DamperGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 2, 2016 - contact company for price
Introduction - Impact dissipates like water ripple, - It’s shown that the egg did not broke after falling on the 20mm thickness silicone rubber pad at a height of 15 meters. - Apply to electronics, industry, medical care, athletic equipment and bed...
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Thermal Interface MaterialsGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 2, 2016 - contact company for price
Thermal Interface Materials: Non- Silicone Soft pad, Non- Silicone Grease, Non- Silicone Putty pad, Non- Silicone Tape, Silicone Soft pad, Silicone Grease, Silicone Putty pad and Silicone Tape, Thermal Conductive Sealing and Thermal Radiation Tape. T...
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Thermal Conductivity Silicone Putty PadGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 1, 2016 - contact company for price
PRODUCT PROPERTIES XK- P50- P XK- P80- P unit Test Method Thickness mm Color Dard Red gray   Visual Construction Silicone   Op. temp. range - 45~150 - 45~150 ℃  Density 3.1 3.3 g/ cm3 ASTM D792 Thermal Conductivity 68 W/ mK ASTM D5470 Breakdo...
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Thermal Conductivity Silicone Gel Pad Interface MaterialsGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 1, 2016 - contact company for price
Model: XK- P20S20 Introduction Thi s series of products are resilient, suitable for large institutional design tolerances. Product is Double- layer structure, reinforcing with special ultra- thin fabric. Good resistance to punching, strip type, Malfo...
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Thermal Conductive Silicone Rubber Pad Xk R20 Thermally Chinese SupplierGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 1, 2016 - contact company for price
Introduction Silicone rubber base with high heat- conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/ m. K. This kind of materials offers super heat- conducting property and maintains the cost efficient to custome...
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Thermally Conductive Silicone Fiberglass Xk F15 Thermal Interface MaterialsGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 1, 2016 - contact company for price
Introduction Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low ...
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Thermal Film Non Silicone Fiberglass Xk Fn10 Thermally ConductiveGeneral Electronics - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - February 1, 2016 - contact company for price
Introduction: XK- FN Non- silicone thermally conductive fiberglass for silicone- sensitive applications. ( EX: LED , Telecom and Aerospace ) . XK- FN: ceramic filled and polyester resins coated either side Features: 1. Polyester based 2. Designed for...
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