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silicon wafer grinding wheels Photos Catalog - WorldBid B2B Market
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Silicon Wafer Back Grinding WheelsEquipment - Abrasives - more super hard product comapny - China - April 17, 2018 - 1.00 Dollar US$Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, ATM, Melchiorre, Peter Wolter...
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Back Grinding Wheels For Gan WaferEquipment - Abrasives - more super hard product comapny - China - April 17, 2018 - 1.00 Dollar US$Back Grinding Wheels for GaN Wafer Silicon wafer back grinding wheels Specifications 1.b e used with Japanese, German, American, Korea and Chinese grinders 2.superior grinding performance 3.high cost performance Shape code Profile Sketch Conventiona...
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Silicon Wafer Back Diamond Grinding WheelEquipment - Abrasives - more super hard product comapny - China - April 24, 2018 - 1.00 Dollar US$Thinning or back grinding wheel Silicon Wafer Back-side Diamond Grinding Wheel Back Grinding W heels for GaN Wafer Silicon wafer back grinding wheels back grinding Wheel for inserts Silicon wafer back grinding wheels are mainly used for the thinning ...
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Back Thinning Grinding Wheel For Silicon WaferCutting Tools - more super hard product comapny - China - April 24, 2018 - 1.00 Dollar US$Thinning or back grinding wheel Silicon Wafer Back-side Diamond Grinding Wheel Back Grinding W heels for GaN Wafer Silicon wafer back grinding wheels back grinding Wheel for inserts Silicon wafer back grinding wheels are mainly used for the thinning ...
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Vitrified Diamond Grinding Wheels For Top And Bottom Of Sapphire Wafer EdgeEquipment - Abrasives - more super hard product comapny - China - December 13, 2018 - 1.00 Dollar US$Vitrified Diamond And CBN Grinding Wheels For Top And Bottom Grinding Of Sapphire Wafer Edge Vitrified bond diamond grinding wheels are usually used for sapphire wafer edge grinding. The double disc surface grinding wheel is mainly used to process va...
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Silicon Wafer Back Side Diamond Grinding WheelEquipment - Abrasives - more super hard product comapny - China - April 17, 2018 - 1.00 Dollar US$Back Grinding Wheels Back Grinding Wheels Are Used For The Thinning And Fine Grinding Of The Silicon Wafer. Name: Diamond Backgrinding Wheel Application: Silicon WaferDiamond Back Grinding Wheels Are Used For Silicon Wafer Grinding. Our Advanced Tech...
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Cz Fz Diode Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter3” 4” 2 Conductivity Type 3 Growth method 4 Resistivity Ω . cm 5 Diameter mm 76.2±0.3 100±0.5 6 Thickness μ m 7 Orientation 8 TTV μ m 9 Bow/ Warp μ m 10 RRV % 11 Oxygen a/ cm3 12 Carbon a/...
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Cz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 3” 4” 6” 8” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <110>±1° , <100>±1° 4 Diameter mm 50.8±0.2 76.2±0.2 100±0.3 154±0.3 200±0.3 5 Thickness μ m 180- 1000 6 Resistivity &...
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Fz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter mm 53- 150±0.2( 2” 3” 4” 5” 6”) 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Resistivity Ω . cm 10- 150 or as required 4 Orientation 5 Thickness μ m 6 Oxygen ppam 7 Carbon ppam 8 TTV/ TIR μ m...
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Monocrystal Silicon Solar WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard specification 1 Wafer Square Side 125x125±0.5mm 156x156±0.5 mm 2 Diagonal Length 150±0.5mm 200±0.5mm 3 Growth Method CZ CZ 4 Conductivity Type 5 Shape Wafer 6 Surface Orientation 7 Dislocation 8 Resistivity 9 Lifetime 10 Carbon Cont...
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Acoustic Devices On Silicon WaferGeneral Electronics - Jinan Jingzheng Electronics Co., Ltd. - China - March 30, 2013 - contact company for price
The need for high-frequency, wide-band filters has instigated many developments based on combining thin piezoelectric films and high acoustic velocity materials to ease the manufacture of devices operating above 2 GHz. In the present work, a technolo...
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Cz Fz Diode Grade Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - May 30, 2014 - contact company for priceConductivity: N type or P type Orientation: <100> +/ - 1 degree Resistivity: 5- 100 RRV: 10% , 12% or 25% Diameter: 3”4” 5” Thickness: ( 200- 600) +/ - 5µm Primary Flat: <110>+/ - 1º Length 32.5+/ - 1.5mm Secondary Flat: 180 degree from p...
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Fz Ntd Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 3” 4” 5” 6” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <100><111>±2 ° 4 Thickness μ m 200- 2000( ±5 or ±10) 5 Resistivity Ω . cm 15- 600 6 RRV % ≤ 8 ≤ 10 &...
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Mcz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter mm 76.2- 200 ( 3” 4” 5’ 6” 8”) 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <100>, <110>, <111> 4 Thickness μ m 180- 1000±20, or as customer required 5 Resistivity Ω ...
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Fz Single Crystal Silicon Wafer 2 Inch 3 4 6 8Components - Other - Western Minmetal (SC) Corporation - China - December 24, 2017 - 1.00 Dollar US$FZ Single Crystal Silicon Wafer 2" 3” 4” 5" 6” at Western Minmetals (SC) Corporation Diameter: 2"3"4”5”6” Conducti vity Type: N type or P type Crystal Orientation: <100>, <111> Resistivity: 10-150 Ohm.cm RRV: 20% 25% max Thickness: 325, 3...
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Single Crystal Silicon Bonding WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 4” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Resistivity Ω . cm ≤ 0.0015 4 Diameter mm 50.8±0.2 100±0.3 5 Thickness μ m 425±25 625±25 6 Orientation 7 Primary length mm 16±1 32±2 8 TTV/...
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Compact Desktop Spin Coater With Ptfe Chamber For Silicon Wafer CoatingEquipment - Scientific - Zhengzhou CY Scientific Instrument Co., Ltd. - China - July 16, 2020 - 2300.00 Dollar US$This type of spin coater is designed small, and the whole body adopts aluminum alloy structure. The upper cover of the chamber is made of PTFE, and the appearance is beautiful and firm. The spin coater adopts advanced precision motor, the maximum spe...
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Centerless Grinding WheelsEquipment - Abrasives - Henan E-Grind Abrasives Co., Ltd - China - September 22, 2017 - 100.00 Dollar US$Diamond & CBN centerless wheels are for TCT cutting tools, bearing parts, automobile parts, plungers, cylinders and engine valves. Our Centerless wheels are divided into two types: Roughing and Finishing . The finest diamond grit used for centerl...
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Back Grinding WheelsCutting Tools - more super hard product comapny - China - January 28, 2018 - 0.10 Dollar US$Back Grinding Wheels Back Grinding Wheels Are Used For The Thinning And Fine Grinding Of The Silicon Wafer. Name: Diamond Backgrinding Wheel Application: Silicon Wafer Details Diamond Back Grinding Wheels Are Used For Silicon Wafer Grinding. Our Adva...
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Crankshaft Grinding WheelsCutting Tools - more super hard product comapny - China - March 3, 2017 - 1.00 Dollar US$For any automotive machine shop to grind crankshafts, they need a good crankshaft grinding wheel to get the job done. The surface finish of a ground crankshaft is highly dependent on the quality of the wheel being used and whether or not it has been ...