Chinafix Cf360 Intelligent Mute Bga Chip Repair Machine - China

CF 360 Working Parameter:

Model: CHINAFIX CF 360

Solder Type: Leaded Solder / Lead Free

SMD Type: Micro bga, BGA, CSP, QFP

PCB Thickness: 0.5mm~4mm

PCB Size: W50mm* D50mm~W455* D350mm

Heating Mode/ Power ( Upper) : Hot- blast air / 800W

Heating Mode/ Power ( Bottom) : Hot- blast air / 800W

Preheating Mode/ Power: IR / 2400W

PCB Location Mode: Shape or Tongs

Drive Mode: Gear, Rack

Control / Adjusting Mode: Temperature control instrument

Temperature Range: Room Temperature 0~400°C

Max Power: 4000W

Supply Volt: 110V/ 220V

Machine Dimension: 760mm( L) * 700mm( W) * 600mm( H)

Weight: 36KG

CF360 characteristic:

1, The hot- air part adopts exported long- life heating coil, through special insulation heating treatment, heating uniformly, long- life to use well.

2, The design of three warm areas support, can fine adjust to support height, avoid welding- area to sink.

3 - The upper hot air- flow can be adjusted, use different air- flow to different chips, it' s not easy to make expand.

4, Upper and bottom hot- air control temperature separately, it can store 10 items with 16 stages temperature curve setting- up.

We can also provide 10 groups of common heating curve.

5, Overtemperature protection function, over the temperature, heating coil automatic power off.

6, Intelligent mute function, keep mute under non- working condition.

7, New type design of air outlet with mixed wind, air- out temperature uniformly.

8, Machincal part adopts oxidation treatment, main machine box use thicken material, prevent shapeless at whole hog.

9, Upper heating part continue to use high- grade products' design of move by X/ Y shaft, treating all kinds of shapeless chips easier.

10, Three warm areas can be controlled separated, to achieve the function of soldering and dry.

11, Complete machine construction adopts the only design of dismounting easily, exchange electric parts simply and conveniently, warranty with fast speed, machine' s rate of utilization reaches the highest.

12, Allocate vacuum attaching- pen, take down chips easily.

Company Contact:

• Posted By: Xinxunwei Technology CO.,LTD

• Phone: 8675561506419

• Address: 3 Floor,No.2 Workshop,Xintang Industrial Park,Bais, shenzhen , China

• Email:

• Website: http://www.xw360.com

• Business Description: Shenzhen Xinxunwei Technology CO., Ltd mainly devotes into the
  
  innovation and marketing of BGA rework stations and pony SMT reflow
  
  soldering equipments, and concentrates on individual maintaining
  
  market and requirements of pony electronic manufactuing enterprises,
  
  so as to manufacture the most economic products with more powerful
  
  function.
  
  Xinxun wei founded in 2009, Production of BGA rework
  
  station.
  
  In China computer repair market, sales of the first, the
  
  first market share.