Bonding Machine For Lcd Repair Refurbishing Touch Screen Pannel - China

Bonding machine for LCD Refurbishment

XCM71 - A5

FOG/ FOB bonding machines，

bonding equipment，

bonding machine，

FOB bonding machine，

bonder machine，

bonder equipment，

1 - About the application field of FOG/ FOB bonding equipment XCM71 - A5

FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel' s production and maintenance; such as， television ( TV) , laptop computers ( NOTE BOOK) , liquid crystal display ( MONITOR) , Tablet PC ( PAD ) , LCD / LCM production enterprises.

2 - About the basic parameters of FOG/ FOB bonding equipment XCM71 - A5

Input Power， AC220V 50- 60Hz

Working pressure ， 0.4- 0 .

8 Mpa

Operating modes， 7- inch HMI

Dimensions， L2210 & times; W1730 & times; H1500 mm

The method of Heating， heating or pulse heating thermostat

The quantity of Fixture， 2 group X- Y- θ micrometer adjustable

Range of Temperature ， RT- 500

Control program， PLC controller

Body main material， Steel + baking varnish

The thermocouple， K type

3 - About the functions and characteristics of the FOG/ FOB bonding equipment XCM71 - A5

3.1use pneumatic components of Japan SMC and high- precision the moving parts

3.2 use temperature controller of Japan and The function module of the integral PID self- tuning temperature, accurate temperature.

3.3 Imported PLC control， the operation of 7- inch full- color touch- screen

3.4SUNSOM the elimination structure of double- cylinder deadweight, accurate pressure.

Company Contact:

• Posted By: Shenzhen Sunsom automatic equipment Co.,Ltd .

• Phone: 8613760490986

• Address: 4/F, Block C, Liyue industrial park, Fenghuan,Fuy, Shenzhen , China

• Email:

• Business Description: Shenzhen Sunsom automatic equipment Co., Ltd .
  
  is a high tech enterprise specialized in R&D, manufacturing and sales of LCD automatic equipment.
  
  we stick to the the enterprise spirit of " efficiency and practicality", have successfully developed，
  
  Constant Heat Bonding Machine, Pulse Heat Bonding Machine , ACF Taking Machine, automation bubble removing Machine, Polarizer Delaminator, HSC Bonding Machine , large size TFT Bonding Machine , PDP Bonding Machine, COG Alignment Machine, COG Bonding Machine, COG Previous Testor, COG Final Testor, ITO Tester, Opencell Testor and etc.
  
  These machines are widely applied to flat panel TFT/LCD .
  
  PDA, PDA;soldering of FPC and FFC to PCB ;polarizer removing, polarizer laminating, ACF laminating, polarizer claving process as well as various flat panel displays bonding and connecting process.