Electroformed Hub Dicing Blade - China

Electroformed Hub Dicing Blade Electroformed Hub Dicing Blade Is Used For Cutting Silicon Wafers, Copper Wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass

Type: Hub Dicing Blade

Application: Silicon Wafer, Copper WaferElectroformed Hub Dicing Blade Is Made By Using An Ultra-Thin Diamond Wheel And A High Precision Aluminum Alloy Hub.

Electroformed Hub Dicing Blade Is Made By Using An Ultra-Thin Diamond Wheel And A High Precision Aluminum Alloy Hub.

Applications Of Hub Dicing Blade:

Cutting Silicon Wafers, Copper Wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass

The Features Of Hub Type Dicing Blade:

* Improving Balance Between Blade Life And Processing Quality (In Particular Backside Chipping)

* Strengthens Rigidity, Reduction In Wavy Cutting And Blade Wear Under High Load Conditions

* Precise Control Of Diamond Grit Size, Diamond Concentration, And Nickel Bond Hardness To Reduce Splitting On The Edges

* Realizes High Speed Wafer Cutting After Laser Grooving.

The Specification Of Hub Type Dicing Blade:

Exposure(Μm) 380 510 640 760 890 1020 1150 1270 Grit Size

Kerf Width(Μm) 380 - 510 510 - 640 640 - 760 760 - 890 890 - 1020 1020 - 1150 1150 - 1270 1270 - 1400 #5000

#4800

#4500

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#3500

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16 - 20 20 * 380 20 * 510 21 - 25 25 * 380 25 * 510 25 * 640 26 - 30 30 * 380 30 * 510 30 * 640 30 * 760 30 * 890 20 * 1020 31 - 35 35 * 380 35 * 510 35 * 640 35 * 760 35 * 890 35 * 1020 36 - 40 40 * 380 40 * 510 40 * 640 40 * 760 40 * 890 40 * 1020 40 * 1150 41 - 50 50 * 380 50 * 510 50 * 640 50 * 760 50 * 890 50 * 1020 50 * 1150 50 * 1270 51 - 60 60 * 510 60 * 640 60 * 760 60 * 890 60 * 1020 60 * 1150 60 * 1270 61 - 70 70 * 640 70 * 760 70 * 890 70 * 1020 70 * 1150 70 * 1270 71 - 80 80 * 890 80 * 1020 80 * 1150 80 * 1270 81 - 90 90 * 1020 90 * 1150 90 * 1270 If you need any products, do not hesitate to contact

Annamoresupe#gmail.

com

Anna.

wang#moresuperhar d.

com

WhatsApp: +861561778592 3

Skype: Annawng

Wechat: 15617785923

QQ: 1664333593

Mobile: +86-15617785492 3

Tel/Fax: +86-0371-86545 906

Company Contact:

• Posted By: more super hard product comapny

• Phone: 15617785923

• Address: B906，Wanda Plaza,Zhongyuan Road，Zhengzhou,Henan,Ch ina, henan , B906，Wanda Plaza,Zhongyuan Road，Zhengzhou,Henan,Ch ina, China

• Email:

• Website: https://www.moresuperhard.com

• Business Description: More Super Hard Products Co., Ltd Is One Of The Leading Company Expert In Supplying Various Ultra Hard Products Including Synthetic Diamond Tools, Cubic Boron Nitride(CBN) Tools, Which Is Widely Used In Petroleum & Geology Industry, Auto & Aviation Processing Industry, Electric Processing Industry, Natural Diamond & Jewelry Processing Industry.
  
  The Company's Production And Sales Of Products Covered Vitrified Bond Tools, Resin Bond Tools, Metal Bond Tools, Electroplated Diamond/CBN Tools, Vaccum Brazed Products, CVD Diamond Tools, Polycrystalline Diamond (PCD) Tools, Cubic Boron Nitride (CBN) Tools.
  
  Our Objective Is To Meet All The Customers Needs And Help Every Customer Achieve Maximum Benefits.
  
  More Brings In Revenue For You, You Win, We Win!
  
  Our Products:
  
  - diamond bruting wheel
  
  - vitrified grinding wheels for pcd and pcbn tools
  
  - vitrified bond diamond wheel for precision grinding of pdc
  
  - cbn internal grinding wheels
  
  - crankshaft grinding wheels