Thermally Conductive Silicone Fiberglass Xk F15 Thermal Interface Materials - China
price: contact company for price
Introduction
Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure.
Recommended using for TO220/ TO3P where insulation is needed.
Features
Elastomeric compound coated on both sides
No oil bleed, long term stability
Electrical insulating
Applications
Power supplies
Automotive electronics
Motor controls
Power semiconductors
  unit XK- F15 XK- F35 XK- F60 Method
Reinforcement Carrier   Fiberglass  
Color   Yellow White White visual
Thickness mm 0.2~0.5 0.3 / 0.38 0.2~0.5 ASTM D374
Specific Gravity g/ cm3 2.4 1.8 1.6 ASTM D792
Hardness Shore A 85 ASTM D2240
Thermal impedance ℃in2/ W 0.48 0.2 0.16 ASTM D5470
Thermal Conductivity W/ mK 1.5 3.5 5.8 HOT DISK
Volume Resistivity ΩcmASTM D257
Breakdown Voltage KV >3.5 >4 >3.5 ASTM D149
Dielectric Constant 1 63 3.2 ASTM D150
Application temperature ℃ - 50~220  
Tensile strength psi >1000 >500 >300 ASTM D149
Elongation % <10 ASTM D149
Siloxane Volatiles D4~D20 % <0.01 GC- FID
Flammability UL94 V- 0 UL94
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 1, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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