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Thermally Conductive Putty Xk G30 Thermal Interface - China
price: contact company for price
Introduction
Syringes packaging, automated production, high temperature resistance, non- corrosive to metal, 100% thermal curing putty, XK- G series is a silicone based, high performance thermal Gel, filling with a variety of high- performance ceramic powder, possessing the features of high thermal conductivity, low thermal resistance, good insulation, infinite compression.
Features
Excellent compressibility
Very low thermal resistance
Good creep performance
Best for north bridge IC
Applications
Consumer electronics / Automotive Systems/ Telecommunications / Hand- set applications
XK- G15 / XK- G20 / XK- G30 / Method
Thermal Conductivity- - - - W/ mK- - - - 1.5 / 2 / 3.2 / HOT DISK
Specific Gravity - - - - g/ cm3- - - - 2.7 / 2.9 / 3.1 / ASTM D792
Breakdown Voltage - - - - KV/ mm- - - - 10 / 10 / 10 / ASTM D149
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 2, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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