Thermal Conductive Silicone Rubber Pad Xk R20 Thermally Chinese Supplier - China

Introduction

Silicone rubber base with high heat- conducting filling materials.

The coefficient of heat conductivity can reach 1.0~ 3.0 W/ m.

K.

This kind of materials offers super heat- conducting property and maintains the cost efficient to customers as well.

Features

High thermal performance, cost- effective solution

Easy to assemble ( 0.1~0.5mm )

Applications

Consumer electronics.

Automotive Systems.

Telecommunications.




Aerospace.

Military.

Medical devices.

Industrial controls.

　 unit XK- R20 XK- R30 XK- R50 Method

Reinforcement Carrier 　 Gray 　

Thickness mm 0.2~0.5 0.2~0.5 0.2~0.5 ASTM D374

Specific Gravity g/ cm3 2.8 3 3.2 ASTM D792

Hardness Shore A 30 50 60 ASTM D2240

Thermal Conductivity W/ mK 2 3 4.8 HOT DISK

Volume Resistivity Ωcm >1013 >1013 >1013 ASTM D257

Breakdown VoltageKV/ mm 13 ASTM D149

Dielectric Constant 1 6.5 7 8 ASTM D150

Application temperature ℃ - 50~200 　

Tensile strength psi 90 80 60 ASTM D149

Elongation % 100 80 40 ASTM D149

Siloxane Volatiles D4~D20 % <0.01 GC- FID

Flammability UL94 V- 0 UL94

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.