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Thermal Conductive Silicone Fiberglass Xk F15 Interface - China
price: contact company for price
Introduction
Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure.
Recommended using for TO220/ TO3P where insulation is needed.
Features
Elastomeric compound coated on both sides
No oil bleed, long term stability
Electrical insulating
Applications
Power supplies
Automotive electronics
Motor controls
Power semiconductors
　 unit- - - - XK- F15/ XK- F35/ XK- F60 Method
Reinforcement Carrier 　 Fiberglass/ 　
Thickness mm- - - - 0.2~0.5/ 0.3 / 0.38/ 0.2~0.5 ASTM D374
Specific Gravity g/ cm3- - - - 2.4/ 1.8/ 1.6 ASTM D792
Hardness Shore A- - - - 80/ 80/ 85ASTM D2240
Thermal impedance ℃in2/ W- - - - 0.48/ 0.2/ 0.16 ASTM D5470
Thermal Conductivity W/ mK- - - - 1.5/ 3.5/ 5.8 HOT DISK
Volume ResistivityΩcm- - - - >1013/ >1013/ >1013 ASTM D257
Breakdown VoltageKV- - - - >3.5/ >4 / >3.5 ASTM D149
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 2, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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