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  • Silicone Sealing Compound Xk S25 Thermal Interfce Conductive - China

    price: contact company for price

    Introduction

    Two part ceramic- filled silicone gels with high thermal conductivity.

    After mixing, reaction will take place at room temperature or speed up the reaction by heating.

    No by- product in cure process.

    Features

    100% solids – no cure by- products

    Ultra- conforming

    Low- stress applications

    Application

    Electrical Machinery

    Computer and peripheral

    XK- S20 / XK- S25 / XK- S32 / Method

    Specific Gravity g/ cm3- - - - - - - 2.6 / 2.8 / 3.1 / ASTM D792

    Hardness Shore 00- - - - 50 / 50 / 80 / ASTM D2240

    Thermal Conductivity W/ mK- - - - - - - 1.8 / 2.5 / 3.2 / HOT DISK

    Breakdown Voltage KV/ mm- - - - - 15 / ASTM D149


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen , China

    • Email: Email


    Published date: February 2, 2016

    • Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.

      We are committed to becoming a leading enterprise in the field of thermal interface materials.

      No significant quality complaint for 18 consecutive years.

      At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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