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Silicone Sealing Compound Xk S25 Thermal Interfce Conductive - China
price: contact company for price
Introduction
Two part ceramic- filled silicone gels with high thermal conductivity.
After mixing, reaction will take place at room temperature or speed up the reaction by heating.
No by- product in cure process.
Features
100% solids – no cure by- products
Ultra- conforming
Low- stress applications
Application
Electrical Machinery
Computer and peripheral
XK- S20 / XK- S25 / XK- S32 / Method
Specific Gravity g/ cm3- - - - - - - 2.6 / 2.8 / 3.1 / ASTM D792
Hardness Shore 00- - - - 50 / 50 / 80 / ASTM D2240
Thermal Conductivity W/ mK- - - - - - - 1.8 / 2.5 / 3.2 / HOT DISK
Breakdown Voltage KV/ mm- - - - - 15 / ASTM D149
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 2, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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