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  • Non Silicone Putty Gel Xk Gn15 Thermal Interface Conductive - China

    price: contact company for price

    Introduction

    Syringes packaging, automated production, high temperature, non- corrosive to metal, 100% thermal curing putty.

    XK- GN series is a high thermal performance Gel , it based on TPR, Filled with a variety of high- performance ceramic powder.

    It also has high thermal conductivity, low thermal resistance, good insulation characteristics .

    Features

    Good compressibility

    Non- silicone

    Non- curing

    Resists pump- out

    Applications

    Consumer electronics.

    Automotive Systems.

    Telecommunications.




    XK- GN15 / XK- GN20 / XK- GN30 / Method

    Thermal Conductivity - - - - - - W/ mK - - - - - 1.4 / 2 / 3 / HOT DISK

    Specific Gravity - - - - - - g/ cm3 - - - - - 2.6 / 2.8 / 3 / ASTM D792

    Low limit BLT Thickness - - - - - - mm - - - - - 0.05 / 0.05 / 0.08 / ASTM D374


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen , China

    • Email: Email


    Published date: February 2, 2016

    • Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.

      We are committed to becoming a leading enterprise in the field of thermal interface materials.

      No significant quality complaint for 18 consecutive years.

      At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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