Glpoly Thermal Gel Alternative To Chomerics Therm A Ge 60 - China

GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties.

XK-G60 is formulated to accommodate todays high performance electronics requirements and designed to transfer a high degree of heat away from hot components to heat sink.

It is a fully cured, no pump out, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler or pad.

Simply dispense thermal gel onto component, assemble heat sink over it, and the product is ready to go.

It is ideal for rework and maintainment situation.

This thermal gel does not require mixing and cure cycle, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible.

Chomerics thermal gel.

With ultra soft properties, this thermal gel can easily deflect under very low compression force and will fill voids and uneven surfaces, accommodating a variety of bond line thickness.

Thermal gel XK-G60 will also wet out matting surfaces in order to efficiently transfer heat from components to the heat sink.

Thermal gel XK-G60 can be stored at room temperature without any filler settling issues and is supplied in one-part.

It is alternative to Chomerics THERM-A-GEL 60

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.