Thermal Material Vs Bergquist Gap Filler Tgf 3600 - China

Glpoly thermal gap filler xk-s40, thermally conductive, two-part, liquid, gap filling material glpoly thermal gap filler xk-s40 is an excellent material in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.

glpoly xk-s40 is a two-component liquid gap filling material, cured at either room or elevated temperature.

compared with bergquist gap filler tgf 3600, xk-s40 provides a higher thermal conductivity of 4.0w/mk.

for electrical propertier, glpoly xk-s40 has excellent electrical insulation, the volume resistivity is 1x1012Ωcm, it offers high reliability.

prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.

the result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process).

the material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing.

once cured, it remains a low modulus elastomer designed to assist in relieving cte stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface.

glpoly thermal gap filler xk-s40 will lightly adhere to surfaces, thus improving surface area contact.

xk-s40 is not designed to be a structural adhesive.

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.