Glpoly Thermal Gap Pad And Laird Tflex 900 - China

GLPOLY XK-P80 is a thermally conductive, electrical insulation thermal gap pad designed for high-power device thermal management.

It features high performance, low thermal resistance and low hardness to make heat transfer effectively.

Compared with Laird Tflex 900, GLPOLY XK-P80 thermal pad shows excellent thermal performance.

Laird Tflex 900 is a high performance thermal pad with 8.0W/mK of thermal conductivity, soft and compliant for component surface.

It has a high deflection at low pressure, and it will wet surface to low contact resistance, making heat transfer rapidly.

GLPOLY XK-P80 provides a low hradness of Shore00 60, it is highly conformable.

Under low pressure, it will fill in air voids, reducing thermal resistance, allowing for excellent interfacing and wet out characteristics, even to surface with high roughness and topography.

XK-P80 thermal gap pad is offered without fiberglass reinforced and has good natural inherent tack on both sides of material, eliminating displacement in assembling process.

GLPOLY XK-P80 provides high thermal conductivity by 8.0W/mK and extremly low thermal ressitance of 0.13℃in2/W.

The performance of XK-P80 thermal gap pad as good as the top class brand such as Bergquist Gap Pad 5000S35, Fujipoly GR80A.

GLPOLY thermal gap pad XK-P80 is excellent alternative to Laird Tflex 900 - It provides high performance and makes your devices operating at its best.

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.